IEC 62137-4:2014

FOREWORD
1 Scope
2 Normative references
3 Terms definitions and abbreviations
4 General
5 Test apparatus and materials
6 Specimen preparation
7 Temperature cycling test
8 Temperature cycling life
9 Items to be specified in the relevant product
  specification
Annex A (informative) - Acceleration of the temperature
        cycling for solder joints
Annex B (informative) - Electrical continuity test for
        solder joints of the package
Annex C (informative) - Reflow solderability test method
        for package and test substrate land
Annex D (informative) - Test substrate design guideline
Annex E (informative) - Heat resistance to reflow soldering
        for test substrate
Annex F (informative) - Pull strength measurement method
for the test substrate land
Annex G (informative) - Standard mounting process for the
        packages
Annex H (informative) - Mechanical stresses to the packages
Bibliography

IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004:
- test conditions for use of lead-free solder are included;
- test conditions for lead-free solders are added;
- accelerations of the temperature cycling test for solder joints are added.