DEFSTAN 00-53/3(2007) : 2007
Withdrawn
SAFE OPERATING LIMITS FOR BACKDRIVING
English
01-01-2007
03-08-2017
Foreword
Introduction
1 Scope
2 Warning
3 Abbreviations & Definitions
4 Guide to In-Circuit Testing
4.1 Overview
4.2 Testers
4.3 Backdriving
4.4 Damage Mechanisms
5 Backdriving Limits
5.1 Detailed Requirements
5.2 Backdriving Conditions
5.3 Pulse Duration
5.4 General Conditions
5.5 Bondwire Temperature Rise
6 Relationship between Backdriving Current & Pulse Duration
6.1 Aluminium Bondwires in hollow packages
6.2 Gold Bondwires in plastic packages
6.3 Gold Bondwires in hollow packages
7 Calculation of Temperature Rise in Bondwires
7.1 Heating due to Current
Annex A Definitions and Abbreviations
A.1 Definitions
A.2 Abbreviations
A.3 IC Types and Families
Annex B Bibliography
Provides requirements for in-circuit testing when used to test electronic components on a panel, electronic circuit (PEC), using node forcing techniques such that one or more integrated circuits on the PEC under test are subjected to backdriving.
| DevelopmentNote |
Supersedes DEFSTAN 00-53/2(1999). (11/2007) This standard is obsolescent because it is no longer required for the procurement of new equipment but is retained for maintenance purposes in support of existing in-service equipment. (01/2012)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
UK Ministry of Defence Standards
|
| Status |
Withdrawn
|
| Supersedes |
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