PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS; CHIP CARRIERS WITH J-LEADS ON FOUR SIDES

Available format(s)

Hardcopy , PDF

Language(s)

German

Published date

01-01-2003

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

INTRODUCTION
1 Scope and object
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 QFJ (square)
  4.1 Introductory remark
  4.2 Component description
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 QFJ (rectangular)
  5.1 Introductory remark
  5.2 Component description
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography
Figures

Specifies information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides.

DevelopmentNote	Supersedes DIN IEC 52-577-CD. (10/2003)
DocumentType	Standard
Pages	21
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Current

Standards	Relationship
NF EN 61188-5-6 : 2003	Identical
BS EN 61188-5-6:2003	Identical
IEC 61188-5-6:2003	Identical
I.S. EN 61188-5-6:2003	Identical
EN 61188-5-6:2003	Identical