IEC 61188-5-6:2003

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 QFJ (square)
  4.1 Introductory remark
  4.2 Component description
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 QFJ (rectangular)
  5.1 Introductory remark
  5.2 Component description
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
Bibliography
Figures

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.