DIN IEC 60326-2 : 1992 AMD 1 1993
Withdrawn
Withdrawn
PRINTED BOARDS; PART 2: TEST METHODS
Published date
01-12-2013
Withdrawn date
02-01-2008
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Vorwort
Einleitung zu IEC 326-2
Einleitung zu IEC 326-2A
Einleitung zu IEC 326-2B
Abschnitt
1 Einführung
2 Anwendungsbereich
3 Zweck
4 Allgemeines
5 Allgemeine Untersuchung
6 Elektrische Prüfungen
7 Mechanische Prüfungen
8 Verschiedene Prüfungen
9 Umweltbeanspruchung
Bilder
Anhang A: Verzeichnis der Prüfungen
Contains test methods and procedures for printed boards, irrespective of their method of manufacture, when they are ready for the mounting of the components, with the object of assessing the properties, dimensions and performance of printed boards.
| DevelopmentNote |
Supersedes DIN 40803-1 (04/2002)
|
| DocumentType |
Standard
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Withdrawn
|
| Supersedes |
| VDI/VDE 2251 Blatt 3:1998-09 | Precision engineering components - Solder connections |
| DIN EN 60603-9:1998-07 | CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 9: TWO-PART CONNECTORS FOR PRINTED BOARDS, BACKPANELS AND CABLE CONNECTORS, BASIC GRID OF 2,54 MM (0,1 IN) |
| DIN EN 123300:1992-11 | SECTIONAL SPECIFICATION; MULTILAYER PRINTED BOARDS |
| DIN EN 60603-8:1998-07 | CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 8: TWO-PART CONNECTORS FOR PRINTED BOARDS FOR BASIC GRID OF 2,54 MM (0,1 IN), WITH SQUARE MALE CONTACTS OF 0,63 MM X 0,63 MM |
| DIN EN 123400:1992-11 | SECTIONAL SPECIFICATION; FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS |
| DIN EN 123500:1992-11 | SECTIONAL SPECIFICATION; FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS |
Summarise
Sorry this product is not available in your region.