DIN EN 123300:1992-11
Withdrawn
SECTIONAL SPECIFICATION; MULTILAYER PRINTED BOARDS
Hardcopy , PDF
01-01-1992
03-07-2021
VORBEMERKUNG
VORWORT
Abschnitt
1 Einführung
1.1 Geltungsbereich und Zweck
1.2 Bezugsdokumente
2 Allgemeines
3 Prüflinge
3.1 Befähigungsprüfprogramm
3.2 Gütebestätigungskontrollen
4 Einzelbestimmung
5 Leiterplattenmerkmale
Tabelle I
Tabelle II
6 Befähigungsprüfprogramm
7 Gütebestätigungskontrollen
8 Prüfbilder
8.1 Anwendung von Prüfbildern
und Prüfplatten
8.2 Kombiniertes Prüfbild (CTP)
8.3 Lagenaufbau der Prüfplatten
8.4 Mehrfachanordnungen des CTP
Bild 2: Kombiniertes Prüfbild
Bild 3: Beispiele gelöteter Löcher
Applies to multilayer printed boards regardless of their method of manufacture, when they are ready for mounting of components. Defines characteristics to be assessed and test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection).
| DocumentType |
Standard
|
| Pages |
36
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Withdrawn
|
| Standards | Relationship |
| CECC 23300 : 85 AMD 1 | Identical |
| EN 123300 : 1992 AMD 1 1995 | Identical |
| BS EN 123300:1992 | Identical |
| NEN EN 123300 : 1995 AMD 1 1995 | Identical |
| I.S. EN 123300:1994 | Identical |
| EN 123300:1992 | Equivalent |
| UNE-EN 123300:1992 | Equivalent |
| DIN IEC 60194:1992-11 | PRINTED CIRCUITS; TERMS AND DEFINITION |
| DIN EN 123000 : 92 AMD 2 97 | GENERIC SPECIFICATION; PRINTED BOARDS |
| DIN IEC 60326-2 : 1992 AMD 1 1993 | PRINTED BOARDS; PART 2: TEST METHODS |
| DIN IEC 60326-6:1994-07 | PRINTED BOARDS - PART 6: SPECIFICATION FOR MULTILAYER PRINTED BOARDS |
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