DIN IEC 60326-6:1994-07
Withdrawn
PRINTED BOARDS - PART 6: SPECIFICATION FOR MULTILAYER PRINTED BOARDS
01-12-2013
11-27-1998
Vorwort
Einleitung zu IEC 326-6
Einleitung zu IEC 326-6A
Abschnitt
1 Einführung
2 Anwendungsbereich
3 Zweck
4 Allgemeines
5 Prüflinge
6 Einzelbestimmung
7 Merkmale von Leiterplatten
8 Prüfbild
Bilder
Defines the characteristics to be assessed, the test methods to be used and establishes uniform requirements for judging properties and dimensions of multilayer printed boards. This standard is intended as a basis on which agreement between purchaser and vendor can be made. Amendment No.1 - Amendment to Clause 8: Test pattern - text boards Gives a new multiple arrangement of the composite test pattern on the board as well as new specimen designs.
| DocumentType |
Standard
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
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| Status |
Withdrawn
|
| VDI/VDE 2251 Blatt 3:1998-09 | Precision engineering components - Solder connections |
| DIN EN 60603-9:1998-07 | CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 9: TWO-PART CONNECTORS FOR PRINTED BOARDS, BACKPANELS AND CABLE CONNECTORS, BASIC GRID OF 2,54 MM (0,1 IN) |
| DIN EN 123300:1992-11 | SECTIONAL SPECIFICATION; MULTILAYER PRINTED BOARDS |
| DIN EN 60603-8:1998-07 | CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 8: TWO-PART CONNECTORS FOR PRINTED BOARDS FOR BASIC GRID OF 2,54 MM (0,1 IN), WITH SQUARE MALE CONTACTS OF 0,63 MM X 0,63 MM |