DIN IEC 62047-9:2008-03 (Draft)
Superseded
Superseded
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
Published date
01-12-2013
Superseded date
03-01-2012
Superseded by
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In diesem Dokument sind Begriffe, Definitionen, Symbole und Messverfahren zur Festigkeit von Full-Wafer-Bondverbindungen innerhalb der Herstellung/Assemblierung von Bauelementen der Mikrosystemtechnik festgelegt.
| DocumentType |
Draft
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| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
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| Status |
Superseded
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| SupersededBy |
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Sorry this product is not available in your region.