EIA STD 4899 : 2017-05
Current
The latest, up-to-date edition.
REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
05-09-2017
1. SCOPE
2. REFERENCES
3. TECHNICAL REQUIREMENTS
4. ADMINISTRATIVE REQUIREMENTS
5. PLAN TERMS, DEFINITIONS, ABBREVIATIONS,
INITIALS, AND ACRONYMS
6. NOTES
APPENDIX A - COMPLIANCE MATRIX
APPENDIX B - REPORT FOR COMPONENTS USED OUTSIDE THE
MANUFACTURER'S SPECIFIED PERFORMANCE LIMITS
APPENDIX C - LIFE-LIMITED COMPONENTS REPORT
Pertains to the development of Plans for integrating and managing electronic components in equipment for the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document.
Committee |
APMC
|
DevelopmentNote |
Supersedes EIA 4899. (11/2007)
|
DocumentType |
Revision
|
ProductNote |
Supersedes EIA 4899. (Seema 11/2007)
|
PublisherName |
Government Electronics & Information Technology Association
|
Status |
Current
|
Supersedes |
SAE ARP6379 | Processes for Application-Specific Qualification of Electrical, Electronic, and Electromechanical Parts and Sub-Assemblies for Use in Aerospace, Defense, and High Performance Systems |
MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
SAE AS6294/2 | Requirements for Plastic Encapsulated Microcircuits in Military and Avionics Applications |
GEIA STD 0016 : 2012 | PREPARING A DMSMS MANAGEMENT PLAN |
EIA 933 : 2015 | REQUIREMENTS FOR A COTS ASSEMBLY MANAGEMENT PLAN |
IEC TR 62396-7:2017 | Process management for avionics - Atmospheric radiation effects - Part 7: Management of single event effects (SEE) analysis process in avionics design |
PD IEC/TR 62396-7:2017 | Process management for avionics. Atmospheric radiation effects Management of single event effects (SEE) analysis process in avionics design |
SAE ARP6328 | Guideline for Development of Counterfeit Electronic Parts; Avoidance, Detection, Mitigation, and Disposition Systems |
SAE AS6462A | AS5553A, Fraudulent/Counterfeit Electronic Parts; Avoidance, Detection, Mitigation, and Disposition Verification Criteria |
17/30365636 DC : 0 | BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
SAE ARP6379 | Processes for Application-Specific Qualification of Electrical, Electronic, and Electromechanical Parts and Sub-Assemblies for Use in Aerospace, Defense, and High Performance Systems |
SAE AS5553B | Counterfeit Electrical, Electronic, and Electromechanical (EEE) Parts; Avoidance, Detection, Mitigation, and Disposition |
EIA 933 : 2015 | REQUIREMENTS FOR A COTS ASSEMBLY MANAGEMENT PLAN |
SAE ARP4754A | Guidelines for Development of Civil Aircraft and Systems |
VITA 51.2 : 2016 | PHYSICS OF FAILURE RELIABILITY PREDICTIONS |
IEC TS 62668-1:2016 | Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components |
MIL-HDBK-454 Revision B:2007 | GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT |
IEC TR 62240-1:2013 | Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating |
SAE AS9100D | Quality Management Systems - Requirements for Aviation, Space, and Defense Organizations |
MIL-HDBK-338 Revision B:1998 | ELECTRONIC RELIABILITY DESIGN HANDBOOK |
GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
SAE ARP6338 | Process for Assessment and Mitigation of Early Wearout of Life-limited Microcircuits |
IEC 62396-4:2013 | Process management for avionics - Atmospheric radiation effects - Part 4: Design of high voltage aircraft electronics managing potential single event effects |
MIL-HDBK-217 Revision F:1991 | RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT |
IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
GEIA STD 0016 : 2012 | PREPARING A DMSMS MANAGEMENT PLAN |
IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
IEC 62396-5:2014 | Process management for avionics - Atmospheric radiation effects - Part 5: Assessment of thermal neutron fluxes and single event effects in avionics systems |
IEC 62396-3:2013 | Process management for avionics - Atmospheric radiation effects - Part 3: System design optimization to accommodate the single event effects (SEE) of atmospheric radiation |
SAE ARP5890A | Guidelines for Preparing Reliability Assessment Plans for Electronic Engine Controls |
GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
GEIA STD 0009 : 2008 | RELIABILITY PROGRAM STANDARD FOR SYSTEMS DESIGN, DEVELOPMENT AND MANUFACTURING |
GEIA STD 0008 : 2011 | DERATING OF ELECTRONIC COMPONENTS |
IEC 62396-1:2016 | Process management for avionics - Atmospheric radiation effects - Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment |
GEIA STD 0003 : 2006 | LONG TERM STORAGE OF ELECTRONIC DEVICES |
IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
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