SAE ARP 6379 : 2016
|
PROCESSES FOR APPLICATION-SPECIFIC QUALIFICATION OF ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS AND SUB-ASSEMBLIES FOR USE IN AEROSPACE, DEFENSE, AND HIGH PERFORMANCE SYSTEMS
|
SAE AS 5553B : 2016
|
COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION
|
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
|
AIAG IATF 16949 : 2016
|
QUALITY MANAGEMENT SYSTEM REQUIREMENTS FOR AUTOMOTIVE PRODUCTION AND RELEVANT SERVICE PART ORGANIZATIONS
|
GEIA STD 0005-3 : 2013
|
PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES
|
SAE AS 6171 : 2016
|
TEST METHODS STANDARD; GENERAL REQUIREMENTS, SUSPECT/COUNTERFEIT, ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS
|
MIL-STD-883 Revision K:2016
|
TEST METHOD STANDARD - MICROCIRCUITS
|
IEC 61967-1:2002
|
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
|
SAE AS 6081 : 2012
|
FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS: AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION - DISTRIBUTORS
|
IEC 61340-5-1:2016
|
Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
|
MIL-PRF-19500 Revision P:2010
|
SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
|
IEC TR 61340-5-2:2007
|
Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
|
IEC TS 62668-1:2016
|
Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
|
RTCA DO 254 : 2000
|
DESIGN ASSURANCE GUIDANCE FOR AIRBORNE ELECTRONIC HARDWARE
|
SAE J 1752/3 : 2011
|
MEASUREMENT OF RADIATED EMISSIONS FROM INTEGRATED CIRCUITS - TEM/WIDEBAND TEM (GTEM) CELL METHOD; TEM CELL (150 KHZ TO 1 GHZ), WIDEBAND TEM CELL (150 KHZ TO 8 GHZ)
|
IEC TR 62240-1:2013
|
Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
|
GEIA HB 0005-3 : 2008
|
REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
|
ESDA/JEDEC JS-001 : 2017
|
ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL
|
IEC TS 62647-3:2014
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
|
IEC 62396-4:2013
|
Process management for avionics - Atmospheric radiation effects - Part 4: Design of high voltage aircraft electronics managing potential single event effects
|
GEIA HB 0005-1 : 2006
|
PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
|
IEC TR 62396-7:2017
|
Process management for avionics - Atmospheric radiation effects - Part 7: Management of single event effects (SEE) analysis process in avionics design
|
ISO 9004:2009
|
Managing for the sustained success of an organization A quality management approach
|
MIL-HDBK-263 Revision B:1994
|
ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT
|
IEC TS 62564-1:2016
|
Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
|
IEC Q 03-4 : 3.0
|
IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PRODECURE - PART 4: IECQ AVIONICS SCHEME - AVIONICS PARTS AND ASSEMBLY MANAGEMENT
|
GEIA STD 0016 : 2012
|
PREPARING A DMSMS MANAGEMENT PLAN
|
IEC 62396-5:2014
|
Process management for avionics - Atmospheric radiation effects - Part 5: Assessment of thermal neutron fluxes and single event effects in avionics systems
|
IEC 62396-3:2013
|
Process management for avionics - Atmospheric radiation effects - Part 3: System design optimization to accommodate the single event effects (SEE) of atmospheric radiation
|
ISO 9001:2015
|
Quality management systems — Requirements
|
EIA STD 4899 : 2017-05
|
REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
|
ISO 9000:2015
|
Quality management systems — Fundamentals and vocabulary
|
MIL-PRF-38535 Revision K:2013
|
Integrated Circuits (Microcircuits) Manufacturing, General Specification for
|
SAE AS 6496 : 2014
|
FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS: AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION - AUTHORIZED/FRANCHISED DISTRIBUTION
|
AIAA R 100 : A 2001
|
RECOMMENDED PRACTICE FOR PARTS MANAGEMENT
|
MIL-STD-3018 Base Document:2007
|
Parts Management (S/S by MIL-STD-11991)
|
GEIA STD 0008 : 2011
|
DERATING OF ELECTRONIC COMPONENTS
|
GEIA STD 0002-1 : 2005
|
AEROSPACE QUALIFIED ELECTRONIC COMPONENT (AQEC) REQUIREMENTS, VOLUME 1 - INTEGRATED CIRCUITS AND SEMICONDUCTORS
|
IEC 60695-11-5 : 2.0
|
FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
|
IEC TS 62647-2:2012
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
|
EN 190000:1995
|
Generic Specification: Monolithic integrated circuits
|
SAE AS 9000 : 1998
|
AEROSPACE BASIC QUALITY SYSTEM STANDARD
|