IPC J STD 020D-1:2008
Superseded
Superseded
View Superseded by
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
Available format(s)
PDF
Language(s)
English, Chinese
Published date
03-01-2008
Publisher
Superseded date
02-04-2018
Superseded by
Excluding Tax where applicable
Summarise this standard
AI-generated summary
1 PURPOSE
2 APPLICABLE DOCUMENTS
3 APPARATUS
4 CLASSIFICATION/RECLASSIFICATION
5 PROCEDURE
6 CRITERIA
7 MOISTURE/REFLOW SENSITIVITY
CLASSIFICATION
8 OPTIONAL WEIGHT GAIN/LOSS ANALYSIS
9 ADDITIONS AND EXCEPTIONS
ANNEX A
ANNEX B
Pertains to all nonhermetic SMDs in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow.
| DevelopmentNote |
Supersedes IPC SM 786 and EIA JESD 22 A112. Included in IPC C 103 & IPC C 1000. (10/2012) Jointly published by IPC & JEDEC. D.1 2008 Edition is still available in Russian Language See separate records. Also available in Chinese Language, See J STD 020 CHINESE. (05/2016) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
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| Pages |
24
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC PAS 62190:2000 | Identical |