IPC SM 786 : A1995
Superseded
Superseded
View Superseded by
PROCEDURES FOR CHARACTERIZING AND HANDLING OF MOISTURE/REFLOW SENSITIVE ICs
Available format(s)
PDF
Language(s)
English
Published date
11-23-2012
Publisher
Superseded date
07-23-2013
Superseded by
Excluding Tax where applicable
Pools the resources of component manufacturers and users to provide a cohesive problem statement and a consensus on what steps should be taken to prevent component cracking. Describes the extent of the problem within the industry, review its history, and discusses cracking failure modes. Provides recommendations on handling plastic chip carriers in order to reduce cracking problems. Also included is a test method that may be used to evaluate cracking susceptibility.
| DevelopmentNote |
classification criteria only is superseded by J-STD-020
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IEC PAS 62190:2000 | Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices |
| 12/30261600 DC : DRAFT MAR 2012 | BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
| IPC 9501 : 0 | PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS) |
Summarise