IPC SM 786 : A1995
Superseded
Superseded
View Superseded by
PROCEDURES FOR CHARACTERIZING AND HANDLING OF MOISTURE/REFLOW SENSITIVE ICs
Available format(s)
PDF
Language(s)
English
Published date
11-23-2012
Publisher
Superseded date
07-23-2013
Superseded by
Excluding Tax where applicable
Summarise this standard
AI-generated summary
Pools the resources of component manufacturers and users to provide a cohesive problem statement and a consensus on what steps should be taken to prevent component cracking. Describes the extent of the problem within the industry, review its history, and discusses cracking failure modes. Provides recommendations on handling plastic chip carriers in order to reduce cracking problems. Also included is a test method that may be used to evaluate cracking susceptibility.
| DevelopmentNote |
classification criteria only is superseded by J-STD-020
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |