IPC J STD 033C-1:2014
Superseded
View Superseded by
HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
08-01-2014
09-21-2023
1 FOREWORD
2 APPLICABLE DOCUMENTS (Normative)
3 DRY PACKING
4 DRYING
5 USE
6 BOARD REWORK
7 DERATING DUE TO FACTORY
ENVIRONMENTAL CONDITIONS
APPENDIX A - Test Method for Reversible
(Type 1) RH Spots on a
Humidity Indictor Card (HIC)
used with Electronic Device
Packaging
APPENDIX B - Derivation of Bake Tables
APPENDIX C - Desiccant Unit Absorption
Capacity Test Method for
Verification
APPENDIX D - Changes in J-STD-033D
Gives manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075.
| Committee |
JC-14.1
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| DevelopmentNote |
Supersedes IPC SM 786 & EIA JEP 124. B.1 2007 Edition is still available in Russian and Italian Languages, See separate records. (02/2012) C2012 Edition is still available in Hungarian, German & Chinese Languages, See separate records. (10/2014) Jointly Published by IPC and JEDEC. (05/2016)
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| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |