EN 60749-15:2010/AC:2011
Withdrawn
Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Amendment of
Published date
02-04-2011
Withdrawn date
04-01-2006
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| DocumentType |
Corrigendum
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
Summarise
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