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EN 60749-15:2010/AC:2011

Withdrawn

Withdrawn

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Amendment of

EN 60749-15:2010

Published date

02-04-2011

Withdrawn date

04-01-2006

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Summarise this standard

DocumentType
Corrigendum
PublisherName
European Committee for Standards - Electrical
Status
Withdrawn

Sorry this product is not available in your region.