EN 60749-20:2003
Withdrawn
Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Published date
06-20-2003
Withdrawn date
10-01-2005
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Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| BS EN 60749-20:2003 | Equivalent |
| I.S. EN 60749-20:2003 | Equivalent |
| UNE-EN 60749-20:2004 | Identical |
| BS EN 60749-20:2003 | Identical |
Summarise
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