Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Published date

06-20-2003

Publisher

European Committee for Standards - Electrical

FOREWORD
INTRODUCTION
1 Scope and object
2 Methods A and B (see also annex A)
3 Method C
4 Method D
5 Methods E and F
6 Method G: Wire ball shear test
7 Information to be given in the relevant specification
Annex A (normative) - Guidance

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

Committee	CLC/SR 47
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current

Standards	Relationship
NF EN 60749-22 : 2003	Identical
IEC 60749-22:2002	Identical
NBN EN 60749-22 : 2004	Identical
NEN EN IEC 60749-22 : 2003	Identical
I.S. EN 60749-22:2003	Identical
PN EN 60749-22 : 2006	Identical
SN EN 60749-22 : 2003	Identical
UNE-EN 60749-22:2004	Identical
BS EN 60749-22:2003	Identical
CEI EN 60749-22 : 2004	Identical
DIN EN 60749-22:2003-12	Identical
BS EN 62317-9:2006	Identical

EN 62435-5:2017	Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
BS EN 62435-5:2017	Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices