EN 60749-34:2004
Withdrawn
Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
Published date
04-16-2004
Withdrawn date
04-01-2007
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Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| I.S. EN 60749-34:2004 | Equivalent |
| BS EN 60749-34:2004 | Equivalent |
| BS EN 60749-34:2004 | Identical |
| UNE-EN 60749-34:2005 | Identical |
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