EN 60749-9:2002
Withdrawn
Withdrawn
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Published date
08-14-2002
Withdrawn date
07-01-2005
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Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive.
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| I.S. EN 60749-9:2002 | Equivalent |
| BS EN 60749-9:2002 | Equivalent |
| UNE-EN 60749-9:2003 | Identical |
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