EN 61182-2-2:2012
Withdrawn
Withdrawn
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
Published date
06-22-2012
Withdrawn date
06-01-2015
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General principles
5 General rules
6 Modeling
7 Report generators
8 Glossary
Annex A (normative) - Printed board fabrication schema
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
IEC 61182-2-2:2012 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked, their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2.
| Committee |
CLC/SR 91
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 61182-2-2:2012 | Identical |
| NF EN 61182-2-2 : 2012 | Identical |
| NBN EN 61182-2-2 : 2012 | Identical |
| NEN EN IEC 61182-2-2 : 2012 | Identical |
| I.S. EN 61182-2-2:2012 | Identical |
| PN EN 61182-2-2 : 2012 | Identical |
| BS EN 61182-2-2:2012 | Identical |
| CEI EN 61182-2-2 : 2013 | Identical |
| DIN EN 61182-2-2:2013-08 | Identical |
| UNE-EN 61182-2-2:2012 | Identical |
| ANSI Y14.5 : 1973 | DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| IEC 61188-5-3:2007 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IPC 2582 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
| IEC 61188-5-8:2007 | Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| IPC 2584 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| ISO 10303-212:2001 | Industrial automation systems and integration — Product data representation and exchange — Part 212: Application protocol: Electrotechnical design and installation |
| IPC 2614 : 0 | SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION |
| IPC 2583 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION |
| ANSI Z210.1 : LATEST | METRIC PRACTICE GUIDE |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC 2615 : 0 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC 2511 : B | GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC 2588 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC D 310 : C | GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES |
| IEC 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| IPC 2501 : 0 | DEFINITION FOR WEB-BASED EXCHANGE OF XML DATA |
| ISO 10303-210:2011 | Industrial automation systems and integration — Product data representation and exchange — Part 210: Application protocol: Electronic assembly, interconnect, and packaging design |
| IEC 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
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