EN 61967-4 : 2002 COR 2017

FOREWORD
1 Scope
2 Normative references
3 Definitions
4 General
  4.1 Measurement basics
  4.2 RF current measurement
  4.3 RF voltage measurement at IC pins
  4.4 Assessment of the measurement technique
5 Test conditions
6 Test equipment
  6.1 Test receiver specification
  6.2 RF current probe specification
  6.3 Test of the RF current probe capability
  6.4 Matching network specification
7 Test set-up
  7.1 General test configuration
  7.2 Printed circuit test board layout
8 Test procedure
9 Test report
Annex A (normative) Probe calibration procedure
Annex B (informative) Classification of conducted
                       emission levels
  B.1 Introductory remark
  B.2 General
  B.3 Definition of emission levels
  B.4 Presentation of results
Annex C (informative) Example of reference levels for
                       automotive applications
  C.1 Introductory remark
  C.2 General
  C.3 Reference levels
Annex D (informative) EMC requirements and how to use
                       EMC IC measurement techniques
  D.1 Introduction
  D.2 Using EMC measurement procedures
  D.3 Assessment of the IC influence to the EMC behaviour
      of the modules
Annex E (informative) Example of a test set-up consisting of
                       an EMC main test board and an EMC
                       IC test board
  E.1 The EMC main test board
  E.2 EMC IC test board
Annex F (informative) 150 ohms direct coupling networks for
        common mode emission measurements of differential
        mode data transfer ICs and similar circuits
Annex ZA (normative) Normative references to international
                       publications with their corresponding
                       European publications

Specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 ohm resistive probe and RF voltage measurement using a 150 ohm coupling network.