IEC 61967-4:2002+AMD1:2006 CSV

FOREWORD
1 Scope
2 Normative references
3 Definitions
4 General
  4.1 Measurement basics
  4.2 RF current measurement
  4.3 RF voltage measurement at IC pins
  4.4 Assessment of the measurement technique
5 Test conditions
6 Test equipment
  6.1 Test receiver specification
  6.2 RF current probe specification
  6.3 Test of the RF current probe capability
  6.4 Matching network specification
7 Test set-up
  7.1 General test configuration
  7.2 Printed circuit test board layout
8 Test procedure
9 Test report
Annex A (normative) Probe calibration procedure
Annex B (informative) Classification of conducted emission
                      levels
  B.1 Introductory remark
  B.2 General
  B.3 Definition of emission levels
  B.4 Presentation of results
Annex C (informative) Example of reference levels for
                      automotive applications
  C.1 Introductory remark
  C.2 General
  C.3 Reference levels
Annex D (informative) EMC requirements and how to use EMC IC
                      measurement techniques
  D.1 Introduction
  D.2 Using EMC measurement procedures
  D.3 Assessment of the IC influence to the EMC behaviour
      of the modules
Annex E (informative) Example of a test set-up consisting of
                      an EMC main test board and an EME IC
                      test board
  E.1 The EMC main test board
  E.2 EME IC test board
Annex F (informative) 150 ohm direct coupling networks for
                      common mode emission measurements of
                      differential mode data transfer ICs
                      and similar circuits
  F.1 Basic direct coupling network
  F.2 Example of a common-mode coupling network alternative
      for high speed CAN or LVDS or RS485 or similar systems
  F.3 Example of a common-mode coupling network alternative
      for differential IC outputs to resistive loads (e.g.
      airbag ignition driver)
  F.4 Example of a common-mode coupling network for fault
      tolerant CAN systems
Figures
Tables

Specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods guarantee a high degree of repeatability and correlation of EME measurements. IEC 61967-1 specifies general conditions and definitions of the test methods. The contents of the corrigendum 1 of June 2017 have been included in this copy.
This consolidated version consists of the first edition (2002) and its amendment 1 (2006). Therefore, no need to order amendment in addition to this publication.