IEC 60068-2-58:1989
Superseded
View Superseded by
Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)
Hardcopy , PDF
English - French, Russian
08-15-1989
03-09-2020
Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| BS 2011-2.1Td:1990 | Identical |
| JIS C 0054:1994 | Identical |
| UNE 20501-2-58:1994 | Identical |
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