JIS C 0054:1994
Superseded
View Superseded by
Environmental testing Part 2: Tests -- Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)
English
04-30-1994
11-20-2020
This Standard provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of SMD. The procedures use a solder bath and are applicable only to SMD that is designed to withstand short-term immersion in molten solder.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Japanese Standards Association
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 60068-2-58:1989 | Identical |
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