IEC 60191-2X:1999
Current
Current
Mechanical standardization of semiconductor devices - Part 2: Dimensions
Amended by
Available format(s)
Hardcopy , PDF
Published date
09-30-1999
Publisher
US$114.00
Excluding Tax where applicable
The contents of the corrigendum of January 2000 have been included in this copy.
| DevelopmentNote |
Parts A-V are incorporated in the Consolidated edition of IEC 60191 PT2 (1966 Version). This is an additional supplement. (10/2012) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN IEC 60191-2X : 1999 C1 2000 | Identical |
| NEN-IEC 60191-2X:1999 | Identical |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
Summarise
US$114.00
Excluding Tax where applicable
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