IEC 60191-3:1999
Current
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
Hardcopy , PDF
English - French
10-29-1999
Foreword
1 General
2 Terminology and definitions
3 Cross-referencing of packages
4 Terminal identification - Numbering of terminals
5 Dimensions and reference letter symbols
6 Drawing layout
7 Dimensioning and tolerances
8 Inter-conversion of inch and millimetre dimensions,
and rules for rounding-off
9 Definition of families
10 Examples of drawings
11 Design procedure for dimensions of integrated circuit
packages
12 Rules for mounting integrated circuit packages into
carriers
13 Bending of terminals of QUIL packages
14 Pin grid arrays
15 Rule for orientation of integrated circuit packages in
handling and shipping carriers such as stick magazines
and rails
Annex A (normative) Limits applicable for the dimensions of
integrated circuit package outlines
Annex B (informative) Example drawings showing cross-
referencing of packages, utilization
of reference letter symbols, terminal
identification and index area
Annex C (normative) Terminal identification and numbering of
terminals of devices with terminals
disposed in three or more rows in each
orthogonal direction
Annex D (normative) Recommended dimensions of integrated
circuit packages of Form G family
Annex E (normative) General rules for the preparation of
outline drawings of packages of Form G
intended for automated handling
Annex F (normative) General rules for the preparation of
outline drawings of pin grid arrays
Annex G (normative) Rule for orientation of integrated
circuit packages in handling and shipping
carriers such as stick magazines and rails
Annex G (normative) Rule for orientation of integrated circuit
packages in handling and shipping carriers
such as stick magazines and rails
Annex H (normative) Bottom view method for Terminal No 1
recognition
Annex K (normative) Gate burrs, mold flash and protrusions
Gives guidance on the preparation of drawings of integrated circuits outlines.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Also numbered as BS EN 60191-3. (09/2005) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
113
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60191-3 : 2000 | Identical |
| NEN 10191-3 : 91 AMD 2 97 | Identical |
| NEN EN IEC 60191-3 : 2000 | Identical |
| I.S. EN 60191-3:2000 | Identical |
| PN EN 60191-3 : 2002 | Identical |
| AS 3708.3-1989 | Identical |
| CEI 47-7 : 1ED 1981 | Identical |
| EN 60191-3:1999 | Identical |
| UNE-EN 60191-3:2001 | Identical |