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IEC 60191-4:1987

Superseded

Superseded

View Superseded by

Mechanical standardization of semiconductor devices. Part 4: Coding systems and classification into forms of package outlines for semiconductor devices

Available format(s)

Hardcopy , PDF

Language(s)

English - French, Russian

Published date

03-30-1987

Superseded date

03-09-2020

US$29.00
Excluding Tax where applicable

Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.

Committee
TC 47/SC 47D
DocumentType
Standard
Pages
9
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
BS 3934-4:1992 Identical
UNE 20191-4:1994 Identical

US$29.00
Excluding Tax where applicable