IEC 60191-4:1999+AMD1:2001+AMD2:2002 CSV
Superseded
View Superseded by
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Hardcopy , PDF
English - French
10-22-2002
09-12-2022
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages. This consolidated version consists of the second edition (1999), its amendment 1 (2001) and its amendment 2 (2002). Therefore, no need to order amendments in addition to this publication.
| Committee |
TC 47/SC 47D
|
| DocumentType |
Standard
|
| Pages |
43
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
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