IEC 60749-3:2002
Superseded
View Superseded by
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
Hardcopy , PDF
04-09-2002
09-14-2019
Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.The contents of the corrigendum of August 2003 have been included in this copy.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| Pages |
7
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| BS EN 60749-3:2002 | Identical |
| UNE-EN 60749-3:2003 | Identical |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.