IEC 60749-34:2004
Superseded
View Superseded by
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
Hardcopy , PDF
English, English - French, Spanish, Castilian
03-10-2004
09-12-2022
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| Pages |
8
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| BS EN 60749-34:2004 | Identical |
| UNE-EN 60749-34:2005 | Identical |
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