Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

07-13-2011

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Test procedure
6 Test method
7 Summary
Annex A (normative) - Drop impact test method using test rod
Annex B (informative) - An example of strain gauge attachment
procedure

IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.

Committee	TC 47
DevelopmentNote	Stability Date: 2015. (10/2012)
DocumentType	Standard
Pages	44
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 60749-40 : 2012	Identical
NBN EN 60749-40 : 2011	Identical
NEN EN IEC 60749-40 : 2011	Identical
I.S. EN 60749-40:2011	Identical
PN EN 60749-40 : 2012	Identical
BS EN 60749-40:2011	Identical
CEI EN 60749-40 : 2012	Identical
EN 60749-40 : 2011	Identical
DIN EN 60749-40:2012-02	Identical
UNE-EN 60749-40:2011	Identical

I.S. EN 60749-37:2008	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER
CEI EN 60749-37 : 2008	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER
IEC 60749-37:2008	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
BS EN 60749-37:2008	Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
EN 60749-37:2008	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

IEC 60749-37:2008

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

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IEC 60749-40:2011

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referenced By This Book

Standards Referencing This Book

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