IEC 61189-3:1997
Superseded
View Superseded by
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Hardcopy , PDF
04-10-1997
12-31-2021
Provides a catalogue of test methods representing methodologies andprocedures that can be applied to test materials used formanufacturing interconnection structures (printed boards) andassemblies. It mainly covers chemical, mechanical and electricaltest methods.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
203
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| UNE-EN 61189-3:1997 | Identical |
| UNE-EN 61189-3:2008 | Identical |
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