IEC 61189-3:1997/AMD1:1999
Superseded
Superseded
View Superseded by
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Amendment of
Available format(s)
Hardcopy , PDF
Language(s)
English - French, English
Published date
07-29-1999
Publisher
Superseded date
12-31-2021
Superseded by
US$371.00
Excluding Tax where applicable
Summarise this standard
AI-generated summary
| Committee |
TC 91
|
| DocumentType |
Amendment
|
| Pages |
65
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| BS EN 61189-3:1997 | Identical |
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