IEC 61189-3:1997+AMD1:1999 CSV
Superseded
View Superseded by
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Hardcopy , PDF
English - French
11-27-2006
09-12-2022
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods. This consolidated version consists of the first edition (1997) and its amendment 1 (1999). Therefore, no need to order amendment inaddition to this publication.
| DocumentType |
Standard
|
| Pages |
141
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
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