IEC PAS 60191-6-18:2008
Superseded
View Superseded by
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Hardcopy , PDF
English
01-22-2008
01-07-2010
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Symbols and drawings
6.1 BGA outline
7 Dimensions
7.1 Group 1
7.2 Group 2
8 Recommended BGA variations
This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.
| DocumentType |
Miscellaneous Product
|
| Pages |
19
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NEN NPR IEC/PAS 60191-6-18 : 2008 | Identical |
| IEC 60191-6-5:2001 | Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
| IEC 60191-6-2:2001 | Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
| IEC 60191-6-4:2003 | Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) |
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