NEN NPR IEC/PAS 60191-6-18 : 2008
Superseded
Superseded
View Superseded by
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
Published date
01-12-2013
Publisher
Superseded date
03-24-2010
Superseded by
Sorry this product is not available in your region.
Defines common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC PAS 60191-6-18:2008 | Identical |
Summarise
Sorry this product is not available in your region.