NEN EN IEC 60191-6-18 : 2010
Current
Current
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)
Published date
01-12-2013
Publisher
Sorry this product is not available in your region.
Gives standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
| DevelopmentNote |
Supersedes NEN NPR IEC/PAS 60191-6-18. (04/2010)
|
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60191-6-18:2010 | Identical |
| IEC 60191-6-18:2010 | Identical |
Summarise
Sorry this product is not available in your region.