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IEC PAS 62191:2000

Superseded

Superseded

View Superseded by

Acoustic microscopy for nonhermetic encapsulated electronic components

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

11-28-2000

Superseded date

10-17-2001

US$114.00
Excluding Tax where applicable

FOREWORD
1 Scope
2 Definitions
3 Apparatus
4 Procedure
Annex A - Acoustic Microscopy Check Sheet
Annex B - Potential Image Pitfalls
Annex C - Some Limitations of Acoustic Microscopy
Annex D - Reference Procedure for Presenting Applicable
          Scanned Data

Defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. Provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compounds voids, etc.) nondestructively in plastic packages while achieving reproducibility.

DocumentType
Miscellaneous Product
Pages
16
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
NEN NPR IEC/PAS 62191 : 2001 Identical
IPC J STD 035 : 0 Identical

US$114.00
Excluding Tax where applicable