IEC 60749-35:2006
Current
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Hardcopy , PDF
English - French
07-18-2006
FOREWORD
1 Scope
2 Terms and definitions
3 Test apparatus
3.1 Reflective acoustic microscope system
3.2 Through transmission acoustic microscope system
3.3 Reference packages or standards
3.4 Sample holder
4 Procedure
4.1 General
4.2 Equipment setup
4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet
(example only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
applicable scanned data
Bibliography
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62191. (07/2006) Stability Date: 2021. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
43
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749-35 : 2006 | Identical |
| NEN EN IEC 60749-35 : 2006 | Identical |
| I.S. EN 60749-35:2006 | Identical |
| PN EN 60749-35 : 2009 | Identical |
| BS EN 60749-35:2006 | Identical |
| CEI EN 60749-35 : 2012 | Identical |
| EN 60749-35:2006 | Identical |
| DIN EN 60749-35:2007-03 | Identical |
| UNE-EN 60749-35:2006 | Identical |
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