NEN EN IEC 60749-35 : 2006
Current
Current
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS
Published date
01-12-2013
Publisher
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Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. It provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
| DevelopmentNote |
Supersedes NEN NPR IEC/PAS 62191. (11/2006)
|
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60749-35:2006 | Identical |
| IEC 60749-35:2006 | Identical |
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