IPC A 49 : LATEST
Withdrawn
Withdrawn
SURFACE MOUNT LAND PATTERN ROUND ROBIN ARTWORK - FILM FORMAT
Published date
01-12-2013
Publisher
Withdrawn date
07-23-2013
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This pattern was used in land pattern round robin for evaluating surface mount land patterns called out in IPC-SM-782. Contains land sites for the following components: 68 I/O LCC; 44 I/O LCC; 100 I/O FINE Pitch QFP; 16 I/O DIP; 24 I/O SOIC; MELF; SOT-23; RC1206 and CC1825. Two circuitry layers are provided, a solder mask layer and a solder paste stencil layer. (4 pcs. 29 x 36 cm).
| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Withdrawn
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| IPC EM 782 : 1996 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD SPREADSHEET |
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