IPC EM 782 : 1996
Withdrawn
Withdrawn
SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD SPREADSHEET
Published date
01-12-2013
Publisher
Withdrawn date
07-23-2013
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Provides appropriate size, shape and manufacturing tolerance of lands to ensure sufficient area for the formation of solder fillets, as described in IPC/EIA J-STD-001, which provide optimum electrical connections and permit inspection and test. Each component package and corresponding land pattern has been registered with a unique number. The land patterns accommodate all three performance classifications.
| DocumentType |
Standard
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| PublisherName |
IPC by Global Electronics Association
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| Status |
Withdrawn
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| IPC A 28 : LATEST | SMT ASSEMBLY BENCHMARK ARTWORK |
| IPC A 49 : LATEST | SURFACE MOUNT LAND PATTERN ROUND ROBIN ARTWORK - FILM FORMAT |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
Summarise
Sorry this product is not available in your region.