IPC AM 372 : 1978
Withdrawn
Withdrawn
ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS,
Available format(s)
PDF
Language(s)
English
Published date
04-01-1978
Publisher
Withdrawn date
07-23-2013
Excluding Tax where applicable
Covers requirements for electroless copper film where the part of the conductive layer on an insulating substrate for the additive process.
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| IPC D 319 : 1987 | DESIGN STANDARD FOR RIGID SINGLE AND DOUBLE-SIDED PRINTED BOARDS |
| IPC ML 910 : A1976 | RIGID MULTILAYER PRINTED BOARDS, DESIGN AND END PRODUCTION, SPECIFICATION FOR, |
| IPC SD 320 : B1986 | PERFORMANCE SPECIFICATION FOR RIGID SINGLE AND DOUBLE-SIDED PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| ASTM E 345 : 2016 : REDLINE | Standard Test Methods of Tension Testing of Metallic Foil |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| ASTM B 193 : 2016 : REDLINE | Standard Test Method for Resistivity of Electrical Conductor Materials |
Summarise