IPC ML 910 : A1976
Superseded
Superseded
View Superseded by
RIGID MULTILAYER PRINTED BOARDS, DESIGN AND END PRODUCTION, SPECIFICATION FOR,
Published date
11-23-2012
Publisher
Superseded date
01-01-1991
Superseded by
IPC D 949 : 1987
IPC 2222 : A
IPC 6012 : C
IPC 2221B:2012
IPC ML 950 : C1980
Sorry this product is not available in your region.
Outlines design and product provisions for rigid multilayer printed boards consisting of several layers of conductor patterns on insulating bases separated by an insulating material and interconnected by a continuous metallic interlayer connection.
| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy |
| IPC BP 421 : 80(R1990) | GENERAL SPECIFICATION FOR RIGID PRINTED BOARD BACKPLANES WITH PRESS-FIT CONTACTS |
| ANSI Y14.5 : 1973 | DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
| IPC ML 975 : 1969 | END PRODUCT DOCUMENTATION SPECIFICATION FOR MULTILAYER PRINTED WIRING BOARDS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC L 108 : B | SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS |
| MIL G 45204 : C | GOLD PLATING, ELECTRODEPOSITED |
| IPC L 110 : A | PREIMPREGNATED, B-STAGE EPOXY-GLASS CLOTH FOR MULTILAYER PRINTED CIRCUIT BOARDS |
| MIL-C-14550 Revision B:1983 | Copper Plating (Electrodeposited) (S/S by SAE-AMS2418) |
| IPC L 109 : B | SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS |
| IPC AM 372 : 1978 | ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS, |
| QQ-N-290 Revision A:1971 | NICKEL PLATING (ELECTRODEPOSITED) (S/S BY SAE-AMS-QQ-N-290) |
| IPC ML 950 : C1980 | RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC FC 150 : E | COPPER FOIL FOR PRINTED WIRING APPLICATIONS |
Summarise
Sorry this product is not available in your region.