IPC BP 421 : 80(R1990)
Withdrawn
Withdrawn
GENERAL SPECIFICATION FOR RIGID PRINTED BOARD BACKPLANES WITH PRESS-FIT CONTACTS
Published date
01-12-2013
Publisher
Withdrawn date
07-23-2013
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NO CONTENTS SECTION
Covers the design, fabrication and end-product requirements for rigid printed-board backplane assemblies with press-fit contacts.
| DocumentType |
Standard
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| Supersedes |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| MIL-STD-130 Revision N:2007 | Identification Marking of U.S. Military Property |
| MIL-C-28859 Revision B:1990 | Connector Component Parts, Electrical Backplane, Printed-Wiring, General Specification For |
| MIL-STD-1130 Revision C:2012 | Connections, Electrical, Solderless Wrapped |
| MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
| IPC D 300 : G1984 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC DW 425 : A | DESIGN AND END PRODUCT REQUIREMENTS FOR DISCRETE WIRING BOARDS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC L 108 : B | SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| MIL G 45204 : C | GOLD PLATING, ELECTRODEPOSITED |
| IPC L 110 : A | PREIMPREGNATED, B-STAGE EPOXY-GLASS CLOTH FOR MULTILAYER PRINTED CIRCUIT BOARDS |
| IPC D 310 : C | GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES |
| QQ-C-533 Revision B:1972 | Copper-Beryllium Alloy Strip (Copper Numbers 170 and 172) (S/S by ASTM-B194) |
| IPC ML 910 : A1976 | RIGID MULTILAYER PRINTED BOARDS, DESIGN AND END PRODUCTION, SPECIFICATION FOR, |
| IPC D 390 : A | AUTOMATED DESIGN GUIDELINES |
| IPC L 109 : B | SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS |
| QQ-B-750 Base Document:1961 | Bronze, Phosphor; Bar, Plate, Rod, Sheet, Strip, Flat Wire, and Structural and Special Shaped Sections (S/S by ASTM-B139) |
| NEMA LI 1 : 1998(R2011) | INDUSTRIAL LAMINATED THERMOSETTING PRODUCTS |
| MIL C 21097 : E | CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD, GENERAL PURPOSE GENERAL SPECIFICATION FOR |
| QQ-N-290 Revision A:1971 | NICKEL PLATING (ELECTRODEPOSITED) (S/S BY SAE-AMS-QQ-N-290) |
| IPC L 130 : 1977 | SPECIFICATION FOR THIN LAMINATES, METAL-CLAD, PRIMARILY FOR GENERAL PURPOSE MULTILAYER PRINTED BOARDS |
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Sorry this product is not available in your region.