IPC D 330 : 1992
Withdrawn
Withdrawn
DESIGN GUIDE MANUAL
Available format(s)
PDF
Language(s)
English
Published date
11-23-2012
Publisher
Withdrawn date
07-23-2013
Excluding Tax where applicable
Provides guidelines for layout, design, and packaging of electronic interconnections, that are industry approved. Contains references to relevant specifications - commercial, military, and federal, together with hundreds of graphs, charts, details and photographs. This publication contains the latest data on materials, design and fabrication of rigid single and double-sided boards; multilayers; flexible printed wiring; printed wiring assemblies; documentation; quality assurance and testing; computer aided design; hybrid circuit design.
| DocumentType |
Standard
|
| Pages |
568
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC D 319 : 1987 | DESIGN STANDARD FOR RIGID SINGLE AND DOUBLE-SIDED PRINTED BOARDS |
| IPC 4562 CHINESE : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
Summarise