IPC J STD 028 : 0
Current
Current
PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS
Available format(s)
PDF
Language(s)
English
Published date
08-01-1999
Publisher
Excluding Tax where applicable
Determines construction detail requirements for bumps and other terminal structures used for Flip Chip and Chip Scale carriers. Matches defined standards for differing terminations to a particular interconnection process; includes solder bumps, columns, non-melting stand-offs and conductive polymer deposits.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (08/2008) Jointly published by IPC & EIA. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
60
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Current
|
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