IPC SM 780 : 0
Current
The latest, up-to-date edition.
COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING
07-01-1988
1.0 INTRODUCTION
1.1 Scope
1.2 Purpose
1.3 Classification
1.4 Terms and Definitions
2.0 REFERENCE DOCUMENTS
2.1 Institute for Interconnecting and Packaging
Electronic Circuits (IPC)
2.2 Electronic Industries Association (EIA)
2.3 Military
2.4 Federal
2.5 American National Standards Institute (ANSI)
3.0 COMPONENT PACKAGING AND INTERCONNECTION (CPI)
IMPLEMENTATION CONCEPT
3.1 System Design Sequence
3.2 Technology Trends
3.3 Packaging/Interconnection Assembly
Implementation Techniques
4.0 ELECTRONIC COMPONENT TYPES AND INTERCONNECTION
DEVICES
4.1 General Considerations
4.2 Discrete Component Types
4.3 Semiconductor Package Types
4.4 Sockets and Connectors
5.0 PACKAGING AND INTERCONNECTING STRUCTURE (P&IS) TYPE
5.1 General Considerations
5.2 Organic-Base Material P&IS
5.3 Non-Organic Base Materials
5.4 Supporting-Plane P&I Structures
5.5 Constraining Core P&I Structures
6.0 DESIGN PARAMETERS
6.1 General Considerations
6.2 System Requirements
6.3 Packaging Considerations
6.4 Performance, Reliability and Producibility
6.5 CAD/CAM Relationships
6.6 Testing Considerations
6.7 P&IS Design Issues
7.0 P&I STRUCTURE (P&IS) FABRICATION
7.1 Organic Printed Boards
7.2 Constraining Core P&IS
7.3 Material Considerations
7.4 Process Flow and Control
7.5 Fabricating Techniques
7.6 Quality Conformance Coupons
8.0 ASSEMBLY PROCESSES
8.1 General Considerations
8.2 Process Flow
8.3 Materials
8.4 Component Preparation
8.5 Solder Placement
8.6 Component Placement
8.7 Surface Mounting
8.8 Chip-on-Board Placement
8.9 Component Attachment
8.10 Cleaning
8.11 Conformal Coating
9.0 QUALITY ASSURANCE AND TESTING
9.1 Quality Assurance and Testing
9.2 Solderability
9.3 Quality Assurance Provisions
9.4 Post Assembly Assurance
9.5 Mechanical and Electrical Testing
9.6 Solder Joint Mechanism of Failure
9.7 Handling Electronic Assemblies
10.0 MODIFICATION AND REPAIR
10.1 Basic Rules
10.2 Handling Electronic Assemblies
10.3 General Modification/Repair Procedures
10.4 P&I Structure Modification/Repair
10.5 P&I Assembly Modification/Repair Methods
Figures
Tables
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