IPC TR 482 : 1976
Withdrawn
Withdrawn
NEW DEVELOPMENTS IN THIN COPPER FOILS
Available format(s)
PDF
Language(s)
English
Published date
11-23-2012
Publisher
Withdrawn date
09-18-2023
Excluding Tax where applicable
It is a compendium of technical methods and techniques used for evaluating the quality aspects of present and future interconnection products and electronic assemblies. The report addresses base materials, conductor physical requirements, internal planes, construction, registration, plated through-holes, component mounting areas, cleaning evaluation, solder mask, and printed board electrical requirements.
| DocumentType |
Standard
|
| Pages |
45
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
| IPC TR 484 : 1986 | RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY |
| IPC TR 485 : 1985 | RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY |
| IPC TR 484 : 1986 | RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
Summarise