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IPC TR 484 : 1986

Withdrawn

Withdrawn

RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY

Available format(s)

PDF

Language(s)

English

Published date

11-23-2012

Withdrawn date

09-13-2023

1.0 Introduction
1.1 Objectives and scope
1.2 Background
2.0 Round robin test program
3.0 Round robin results - phase I
3.1 Thickness measurements
3.2 Test mandrel selection
3.3 Tensile properties
3.4 Grain structure
4.0 Recommendations - phase I
5.0 Copper foil fatigue behavior and cyclic life
     predictions
6.0 Round robing results - phase II
6.1 Standard electrodeposited copper foil, CF-E1
6.2 High-ductility electrodeposited copper foil, CF-E2
6.3 High temperature ductility electrodeposited copper
     foil CF-E3
6.4 Annealed electrodeposited copper foil, CF-E4
6.5 As-rolled wrought copper foil, CF-W5
6.6 Annealed wrought copper foil, CF-W7
6.7 Low temperature annealable wrought copper foil,
     CF-W8
6.8 Ductility results from 40-mil diameter test
     mandrels
7.0 Miscellaneous observations
8.0 Summary, conclusions and recommendations
8.1 Conclusions
8.2 Recommendations
References
Appendices
A IPC test plan for copper foil ductility round robin
B IPC test method 2.4.2.1 of IPC-TM-650, "Flexural
     Fatigue and Ductility, Foil", August 1980
C Operating instructions for fatigue ductility flex
     tester
D Data sheet sample
E IPC test method 2.4.2.1 of IPC-TM-650, "Flexural
     Fatigue and Ductility, Foil," Revision A, December
     1983
Figures
1 Means, standard deviations and ranges of measured
     gauge thicknesses of wrought and electrodeposited
     copper foil samples normalized relative to means
     from test lab A
2 Means, standard deviations and ranges of measured
     gauge and core thicknesses of electrodeposited
     copper foil samples normalized relative to means
     from test lab A
3 Photomicrographic cross-section of 2 oz./ft2
     electrodeposited copper foil sample
4 Means of measured gauge and plating tooth/adhesion
     treatment thicknesses differentiated by foil weight
     and vendor
5 Manson-Coffin plot (cyclic strain range vs. fatigue
     life) showing contributions of elastic and plastic
     strains and deviation at extremely low-cycle
     fatigue
6 Manson-Coffin plot of a CF-E3-2-S(XM) copper foil
     sample showing fatigue data ranging from 4.0 to
     185,00 cycles-to-failure superimposed on fatigue
     curve predicted from tensile properties
7 Manson-Coffin plot of predicted and experimental
     fatigue behavior of CF-E1-1-S and CF-E4-1-S copper
     foil samples
8 Manson-Coffin plot of predicted and experimental
     fatigue behavior of CF-W5-1-S and CF-W7-1-S copper
     foil samples
9 Manson-Coffin plot of predicted and experimental
     fatigue behavior of CF-E1-1-S and CF-W5-1-S copper
     foil samples
10 Ductility results for standard electrodeposited
     copper foil, CF-E1, for various foil weights and
     foil vendors
11 Ductility results for high-ductility
     electrodeposited copper foil, CF-E2, for various
     foil weights and foil vendors
12 Ductility results for high temperature ductility
     electrodeposited copper foil, CF-E3, for various
     foil weights and foil vendors
13 Ductility results for annealed electrodeposited
     copper foil, CF-E4, for various foil weights and
     foil vendors
14 Ductility results for as-rolled wrought copper
     foil, CF-W5, for various foil weights and foil
     vendors
15 Ductility results for annealed wrought copper
     foil, CF-W7, for various foil weights and foil
     vendors
16 Ductility results for low temperature annealable
     wrought copper foil, CF-W8, before and after
     annealing for various foil weights and foil vendors
Tables
1 Copper foil sample distribution for ductility round
     robin study
2 Tensile strengths of the copper foil samples
     submitted for the ductility round robin study
3 Proposed and established minimum ductility
     requirements for IPC Standard ANSI/IPC-CF-150
4 Comparison of fatigue lives and ductility results
     from tests with 79-, 62- and 40-mil diameter
     mandrels

Determines ductility of the foils provided by the industry's copper foil vendors.

DocumentType
Standard
Pages
46
PublisherName
IPC by Global Electronics Association
Status
Withdrawn

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