ISO 9454-2:1998
Withdrawn
Withdrawn
View Superseded by
Soft soldering fluxes — Classification and requirements — Part 2: Performance requirements
Available format(s)
Hardcopy , PDF
Language(s)
English, French
Published date
08-20-1998
Withdrawn date
04-09-2025
Superseded by
US$96.00
Excluding Tax where applicable
| DocumentType |
Standard
|
| Pages |
7
|
| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| NBN EN ISO 9454-2 : 2000 | Identical |
| NEN EN ISO 9454-2 : 2000 | Identical |
| NEN ISO 9454-2 : 1998 | Identical |
| NS EN ISO 9454-2 : 1ED 2000 | Identical |
| I.S. EN ISO 9454-2:2000 | Identical |
| PN EN ISO 9454-2 : 2004 | Identical |
| BS EN ISO 9454-2:2001 | Identical |
| EN ISO 9454-2:2000 | Identical |
| NF EN ISO 9454-2 : 2000 | Identical |
| DIN EN ISO 9454-2:2000-09 | Identical |
| UNE-EN ISO 9454-2:2000 | Identical |
| DIN EN 16125:2016-03 | LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| BS EN 61190-1-1:2002 | Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| I.S. 820:2010 | NON-DOMESTIC GAS INSTALLATIONS |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| CEI EN 60068-2-58 : 2016 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| EN IEC 61190-1-3:2018 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
| I.S. EN 61190-1-3:2007 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| DIN EN 1775:2007-10 | Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations |
| I.S. EN 1775:2007 | GAS SUPPLY - GAS PIPEWORK FOR BUILDINGS - MAXIMUM OPERATING PRESSURE LESS THAN OR EQUAL TO 5 BAR - FUNCTIONAL RECOMMENDATIONS |
| 15/30318681 DC : 0 | BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| NF ISO 26842-1 : 2009 | ADHESIVES - TEST METHODS FOR THE EVALUATION AND SELECTION OF ADHESIVES FOR INDOOR WOOD PRODUCTS - PART 1: RESISTANCE TO DELAMINATION IN NON-SEVERE ENVIRONMENTS |
| BS EN 61190-1-2:2014 | Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| 05/30133283 DC : DRAFT MAY 2005 | IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| BS EN 61190-1-3 : 2007 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| I.S. EN 61190-1-2:2014 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| BS EN 16125:2015 | LPG Equipment and Accessories. Pipework systems and supports. LPG in liquid phase and vapour pressure phase |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
| 05/30133287 DC : DRAFT MAY 2005 | IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| I.S. EN 16125:2015 | LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG IN LIQUID PHASE AND VAPOUR PRESSURE PHASE |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 61190-1-3:2017 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| EN 1775:2007 | Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations |
| EN 16125:2015 | LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase |
| 10/30227098 DC : 0 | BS EN 16125 - LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE |
| 12/30258438 DC : 0 | BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| I.S. EN 61190-1-1:2002 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
| BS EN 1775:2007 | Gas supply. Gas pipework for buildings. Maximum operating pressure less than or equal to 5 bar. Functional recommendations |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| UNE-EN 16125:2020 | LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase |
| UNE-EN 16125:2016 | LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase |
| I.S. EN IEC 61190-1-3:2018 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| ISO 9455-10:2012 | Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method |
| ISO 9455-11:2017 | Soft soldering fluxes — Test methods — Part 11: Solubility of flux residues |
| ISO 9455-15:2017 | Soft soldering fluxes — Test methods — Part 15: Copper corrosion test |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| ISO 9454-1:2016 | Soft soldering fluxes — Classification and requirements — Part 1: Classification, labelling and packaging |
| ISO 9455-12:1992 | Soft soldering fluxes — Test methods — Part 12: Steel tube corrosion test |
| ISO 9455-9:1993 | Soft soldering fluxes — Test methods — Part 9: Determination of ammonia content |
| ISO 9455-1:1990 | Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method |
| ISO 9455-3:1992 | Soft soldering fluxes — Test methods — Part 3: Determination of acid value, potentiometric and visual titration methods |
| ISO 9455-8:1991 | Soft soldering fluxes — Test methods — Part 8: Determination of zinc content |
| ISO 9455-14:2017 | Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues |
| ISO 9455-13:2017 | Soft soldering fluxes — Test methods — Part 13: Determination of flux spattering |
| ISO 9455-5:2014 | Soft soldering fluxes — Test methods — Part 5: Copper mirror test |
| ISO 9455-6:1995 | Soft soldering fluxes — Test methods — Part 6: Determination and detection of halide (excluding fluoride) content |
Summarise
US$96.00
Excluding Tax where applicable
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